However, don’t expect anything anytime soon. Intel’s Director of Global Strategic Partnerships Sanam Masroor outlined the plans in a blog post. Operations are expected to begin in Q1 2026, with prototypes due in 2027 and commercial products by 2030.
While Intel has not come out and said it, that memory design is almost identical to HBM used in GPU accelerators and AI data centers. HBM sits right on the GPU die for immediate access to the GPU, unlike standard DRAM which resides on memory sticks plugged into the motherboard.
HBM is much faster than DDR memory but is also much more expensive to produce. It’s also much more profitable than standard DRAM which is why the big three memory makers – Micron, Samsung, and SK Hynix – are favoring production of it.
